Mechanical Engineer

We are looking for a Mechanical Engineer to join our Advanced Engineering team and help define the next generation of data‑center power infrastructure. In this role, you will shape the mechanical and thermal architecture for cutting‑edge High‑ and Low‑Voltage DC (HVDC/LVDC) systems that power vast GPU compute fleets. Your work will ensure efficient power delivery, robust operation, and long‑term reliability across multi‑gigawatt deployments.

Key Responsibilities

• Drive the mechanical and thermal design of HVDC/LVDC power‑distribution hardware and high‑power electronic assemblies supporting large‑scale GPU data‑center environments.
• Create structural frameworks, enclosure designs, and integrated cooling solutions for high‑voltage DC equipment and advanced power‑electronics modules.
• Conduct CFD‑based thermal simulations and develop thermal‑management strategies for high‑density systems, including cold plates, heat exchangers, busbars, and airflow‑optimized packaging.
• Engineer high‑current busbar solutions, addressing conductor sizing, thermal‑interface performance, mechanical robustness, and contact‑resistance control in megawatt‑class installations.
• Implement EMI/EMC mitigation approaches, meet creepage/clearance rules, and integrate semiconductor devices, capacitors, and power modules into compact, highly reliable mechanical packages.
• Define and execute verification and validation activities, including structural FEA, vibration and environmental testing, thermal cycling, and qualification plans for power‑electronics assemblies.

Your Background

• 8+ years of mechanical engineering experience within power systems, high‑power electronics, or energy‑infrastructure applications, with a strong emphasis on thermal design.
• Advanced expertise in heat‑transfer engineering, structural design, CFD analysis, and packaging of power‑electronics and outdoor‑rated equipment.
• Skilled with major CAD tools (SolidWorks, AutoCAD) and thermal‑simulation platforms (e.g., Ansys Fluent) with familiarity in HVDC systems and standards such as NEC, UL, or IEC.
• Highly autonomous problem‑solver who excels in rapid‑moving environments and can lead complex multidisciplinary integration projects.
• Strong understanding of materials used for high‑power systems, including conductive alloys, thermal‑interface materials, encapsulation compounds, and high‑voltage insulation.
• Experience applying DFM/DFA principles and transitioning designs from prototype to scalable, high‑volume production using manufacturing methods such as machining, casting, and sheet‑metal fabrication.